Brazing of two-metal system

This is work by Ed Webb at Sandia and Jeff Hoyt at McMaster University to study the interface between Cu and Ni under conditions of brazing to join the metals. A direct correlation between the free energy of the dissolution reaction and the kinetics of pore infiltration was observed.

The snapshots and movie show liquid Cu infiltration into a 10 nm Ni slit pore at 1750K. Cu and Ni atoms are rendered as light and dark spheres. In the figure, results are shown for the non-dissolutive (left) and the dissolutive (right) simulations at varying simulation times: (a) t = 400 ps, (b) t = 900 ps and (c) t = 1400 ps.