Electropolishing-enhanced corrosion resistance mechanisms of 316L stainless steel in semiconductor applications: Inclusion regulation, passive film optimization and aggressive microdroplet suppression

CR Ma and ZC Yang and XZ Jiang and P Zhou and Y Zhao and Y Hua and C Su and T Zhang and FH Wang, CORROSION SCIENCE, 257, 113347 (2025).

DOI: 10.1016/j.corsci.2025.113347

316L stainless steel is exclusively utilized in manufacturing delivery pipelines of electronic special gas (ESG). Long-term exposure to corrosive ESG poses severe corrosion threats to stainless steel components. Particle contamination arising from corrosion products has emerged as a critical challenge impeding the advancement of semiconductor microchips. Electropolishing, a pivotal anti-corrosion techniques in semiconductor applications, enhances the corrosion resistance of 316L stainless steel through three primary mechanisms: 1) surface purification through significant removal of inclusions, 2) passive film optimization by improving structural integrity and flatness at matrix/inclusion interfaces and metal/film interfaces, accompanied by a 277 % increase in the CrOx/FeOx ratio, 3) Effective suppression of aggressive microdroplets formation through surface energy modification.

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