Molecular Dynamics Simulation Study on the Cooling Behavior and Mechanical Properties of Silicone Carbide/Aluminum Composites

GZ Zhou and SM Hao and JP Xie and H Huang and GP Zhang and B Cai and YJ Shi and J Wang and JF Wang, MATERIALS, 18, 3908 (2025).

DOI: 10.3390/ma18163908

The mismatch of the coefficient of thermal expansion (CTE) between the reinforcement and the matrix leads to thermal residual stresses and defects upon cooling from the processing temperature to room temperature. The residual stresses and defects have a significant impact on the mechanical properties of metal-matrix composites. To investigate the effect of cooling temperature on the residual stresses' distribution and mechanical properties of SiC/Al, we investigated the cooling process of SiC/Al from different initial temperatures to room temperature. We found that residual stresses mainly distributed in the interface of SiC/Al composites after cooling, and the higher the initial temperature of cooling, the higher the value of residual stresses and the greater the degree of atomic displacement. During the cooling process, the Shockley partials and stair-rod dislocations were the two dominant dislocation structures. After cooling, the length of Shockley partials was about 80% and the length of stair-rod dislocations was about 18%. The mechanical properties of SiC/Al composites reduced after cooling. These results have filled the gap in understanding the mechanism of defect evolution in SiC/Al composites under cooling conditions, as well as the influence of cooling conditions on the mechanical properties of the material.

Return to Publications page