Effect of Sn on interface bonding properties of copper-steel bimetallic composites

XL Fang and YG Yin and S Huang and JL Miao and M Xu and PP Yao, PHYSICA SCRIPTA, 100, 085977 (2025).

DOI: 10.1088/1402-4896/adf780

Interfacial bonding performance optimization of copper-steel bimetallic composites is a key challenge to improve their engineering service performance. This study focuses on the effect of Sn on Cu/Fe interfacial diffusion, and reveals the correlation law between Sn content (0%-15%) and interface bonding performance. The results show that the introduction of Sn promotes the Cu-Fe interdiffusion, increasing the diffusion coefficient of Cu and Fe, the thickness of the interface transition zone increases from 1.41 mu m to 6.54 mu m, and the proportion of the copper-rich area increases to 92.7%. The proportion of (alpha+delta) eutectoid phase increases with the increase of Sn content. XRD results show that the diffraction intensity of delta phase at the interface is positively correlated with Sn content. The evolution of phase compositions in copper layer promotes the change of fracture mode from toughness to brittleness. This study clarifies the interface binding mechanism of alloying elements and provides theoretical guidance for composition design and property prediction of copper-steel composites.

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