Atomic-scale insights into friction and wear mechanisms of Cu-Al interfaces under multifactor conditions: A molecular dynamics investigation

GQ Wang and C Li and GF Lu and T Yang and J Zhao and J Li and G Zhao, MATERIALS TODAY COMMUNICATIONS, 48, 113421 (2025).

DOI: 10.1016/j.mtcomm.2025.113421

Understanding the atomic-scale friction and wear mechanisms of Cu-Al interfaces is of great significance for the design and reliability of bimetallic components in aerospace, electronics, and microelectromechanical systems. This study employs molecular dynamics (MD) simulations to explore the effects of interference depth, sliding velocity, and temperature on the frictional performance of Cu-Al hemispherical contacts. Results indicate that increased interference depth intensifies plastic deformation and dislocation activity, promoting adhesive wear. Sliding velocity influences dislocation evolution and strain localization, leading to non-linear wear behavior. Elevated temperatures enhance atomic diffusion and dislocation mobility, facilitating material transfer and altering wear mechanisms. Comprehensive analyses of wear rate, strain distribution, dislocation structures, and energy dissipation reveal the underlying deformation and failure modes. These findings offer atomistic insights into the coupled mechanical-thermal response of Cu-Al interfaces and provide guidance for optimizing their tribological performance in advanced engineering applications.

Return to Publications page