Thermal transport origin of adhesion regulation at liquid-Al/SiO2 friction interface

Y Dong and LJ Yan and H Cheng and R Deng and X Zhang and MP Huang, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 253, 127541 (2025).

DOI: 10.1016/j.ijheatmasstransfer.2025.127541

In process of electrolytic aluminum (Al) production, liquid-Al tends to adhere to the solid surfaces whose main composition is silica (SiO2), which causes a lot of energy loss. However, how to reduce this adhesion remains unresolved. In this paper, two strategies, i.e. applying force to the Al droplet and changing the solid temperature, are proposed to modulate the adhesion at liquid-Al/SiO2 friction interface. Results indicate that increasing applied force or solid temperature can decrease contact angles (CAs) and adhesion at liquid-Al/SiO2 interface. Further research shows that the adhesion strength is determined by interfacial heat transfer capacity. The decrease in phonon participation rate under enhanced applied forces and elevated solid temperatures induces a decline in interfacial thermal conductance, ultimately leading to weakened adhesion. Our investigations provide new approaches for reducing energy dissipation at liquid-Al/solid adhesion interface.

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