Mechanism of the influence of vibration dimensions on the removal behavior of SiC ceramics at the nanoscale: convection impact effect and chip separation

BB Meng and Z Han and FS Liang and Z Wang and C Fan, SURFACES AND INTERFACES, 72, 107077 (2025).

DOI: 10.1016/j.surfin.2025.107077

SiC ceramic material exhibits excellent mechanical properties and chemical stability. Its ultra-precision machining technology has always been a hot topic of research. The machinability and influence mechanisms of materials under different vibration modes are directly presented, with the corresponding results providing effective theoretical guidance for process optimization. This work aims to analyze the ductile removal process and fully explain the chip separation behavior and deformation mechanism of SiC ceramics. The coupling effects of vibrations on the removal behaviors of SiC ceramic and the impact of combinations on chip separation mechanisms and deformation behaviors are investigated. The microscopic flow pattern of materials differs from that of single crystal materials, representing a plastic separation mode that can be ejected following the formation of amorphous state. In the micro- grinding process, amorphous transition behavior dominates the entire grinding process. Convection impingement has also been identified, effectively enhancing material removal efficiency and reducing abrasive wear.

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