Effect of anisotropy on the removal mechanism of soft and brittle single crystal ZnSe under nanoscratching

RD Zhang and XJ Yang and GY Du and T Yao and BH Cheng, INFRARED PHYSICS & TECHNOLOGY, 150, 105982 (2025).

DOI: 10.1016/j.infrared.2025.105982

ZnSe crystal is an ideal infrared optical material due to its excellent optical properties and spectral range. Its anisotropy affects the surface quality and material removal efficiency in ultra-precision machining. The material removal mechanism, cutting force distribution and stress distribution of ZnSe (100), (110) and (111) crystal planes at the atomic scale were studied by combining molecular dynamics (MD) simulation and nano-scratch experiments. The origin of anisotropic plastic deformation and material removal mechanism was explained from the atomic scale. Nano-scratch experiments were carried out on single crystal ZnSe (100), (110) and (111) crystal planes. The surface morphology of the scratch groove under different conditions was analyzed by optical microscopy and scanning electron microscopy (SEM). The anisotropy dependence of damage evolution and material removal behavior of soft and brittle optical material ZnSe crystal during micro-nanoscale machining was studied. The results show that the material removal mechanism, cutting force and stress of single crystal ZnSe (100), (110) and (111) planes at the atomic scale are anisotropic; the nanoscratch morphology, critical depth of brittle-ductile transition, critical load and friction coefficient are also anisotropic. ZnSe (110) 1-10 direction is the preferred crystal plane and crystal orientation for ultra-precision machining.

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