The description of wear mechanism for diamond cutting tool with a new diamond model on gold substrate

DX Zhou and Q Shen and XL Zhang and P Wang and AM Nie and HT Wang, DIAMOND AND RELATED MATERIALS, 157, 112526 (2025).

DOI: 10.1016/j.diamond.2025.112526

The wear mechanism of diamond cutting tool has always been a significant concern in ultra-high precision manufacturing. Traditional interatomic potentials often overestimate diamond tool wear, leading to discrepancies between simulation results and the actual service life of diamond tools in industry. Therefore, the existed molecular dynamics simulations mostly focused on the influences of cutting conditions on workpieces, rather than the diamond tool itself. In this work, a new diamond potential called TersoffHP is developed based on our previous work with an additional term of directional density function. The stability of the diamond cutting tool in operation is significantly enhanced with this modification. A series of MD simulations have been conducted to demonstrate the improved wear resistance of diamond tools predicted by the TersoffHP potential. The diamond tool utilizing the 110 plane as the rake face exhibits enhanced durability compared to other crystal orientations. In the machining process of twinned gold workpieces, a large portion of dislocation activities is excited due to the high shear force exerted by the diamond tool, leading to the offset of twin boundaries and detwinning. This newly developed potential model is expected to provide a more accurate framework for simulating diamond machining of various materials.

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