Molecular dynamics simulation study on the tensile deformation behavior of nanotwinned Cu-Ag alloy

HF Li and HF Xie and YZ Zhao and WJ Zhang and L Huang and Y Yuan and H Chu and XJ Mi, MATERIALS TODAY COMMUNICATIONS, 45, 112270 (2025).

DOI: 10.1016/j.mtcomm.2025.112270

To reveal the mechanism of nano-twin in the plastic deformation process of Cu-Ag alloys, molecular dynamics simulations were used to study the tensile deformation behavior of nanotwinned Cu-7.8 wt% Ag alloy with different nano-scaled twin lamellae thickness. The results indicated that the thickness of twin lamellae played an important role in the strength and the ability to form secondary twins of Cu-7.8 wt% Ag alloy. The plastic deformation of this alloy was dominated by Shockley incomplete dislocations. The twin boundaries hindered the movement of dislocations and the propagation of stacking faults. The plastic deformation mainly occured between the twin lamellaes. The smaller the thickness of twin lamellae, the greater the obstruction of dislocation movement and the more obvious the strengthening effect. When the thickness of twin lamellae was less than 15.22 nm, it was difficult to form secondary twins. The twin boundaries absorbed dislocations while hindering which, with good tensile mechanical stability during the plastic deformation This study investigated the stability and dislocation absorption capacity of twin boundaries during plastic deformation, providing new ideas and methods for the development of high-strength and high-ductility nano-twinned metallic materials.

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