Molecular dynamics simulation study on the nano-cutting mechanism of polycrystalline layered aluminum film using negative rake angle cutting tools and micro-laser assistance

JY Liu and GF Shi and SW Meng and ZW Jiang, MATERIALS TODAY COMMUNICATIONS, 44, 112163 (2025).

DOI: 10.1016/j.mtcomm.2025.112163

In this study, we utilized molecular dynamics simulation techniques to gain a deeper understanding of the atomic scale details of material plastic flow behavior and removal process during nano cutting of polycrystalline layered aluminum films using different negative rake angle cutting tools and laser assisted machining (LAM). The results show that the negative rake angle of the tool and LAM have a significant dependence on the stagnation region during substrate cutting. When the negative rake angle of the tool decreases, the area of the stagnation region will expand accordingly. Compared with conventional machining (CM), LAM can effectively reduce the area of stagnation region. Furthermore, as the negative rake angle of the tool decreases, the normal cutting force rapidly increases, while the tangential cutting effect gradually weakens, and the plowing and pressing effects gradually dominate. At the same time, when a larger negative rake angle is applied, the material will experience higher hydrostatic stress, and the introduction of laser energy causes the hydrostatic stress value of the cutting area material in the LAM process to be lower than that in CM. In addition, when performing large cutting depths, the cutting force increases and the stagnation region is more likely to form at interlayer grain boundaries.

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