Influence of the anisotropy of single crystal 4H-SiC on contact
responses during nanoindentation and microscratch
ZF Ni and ZY Chen and GM Chen and XY Lu and GH Chen and M Liu, APPLIED
PHYSICS A-MATERIALS SCIENCE & PROCESSING, 131, 206 (2025).
DOI: 10.1007/s00339-025-08314-3
The effect of anisotropy, which is crucial for manufacturing single
crystals, was investigated in this study by performing nanoindentation
experiments on the Si/C plane of single crystal 4H-SiC with the edge of
Berkovich indenter toward with two different crystal orientations of
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when the edge was toward crystal orientation
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hardness is 39.37/39.77 GPa, the elastic modulus is 528.16/513.88 GPa,
and the fracture toughness is 3.286/2.609 MPam1/2. On the C
plane, when the edge was toward crystal orientation
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hardness is 43.66/41.91 GPa, the elastic modulus is 522.24/546.54 GPa
and the fracture toughness is 2.826/2.705 MPam1/2. At the
same time, the Vickers hardness crack induction method was used to
calculate the fracture toughness, regardless of the Si or C plane, the
fracture toughness value of the crystal orientation
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00$$\enddocument. Molecular dynamics (MD) indentation simulations
were carried out with the indenter edge facing different crystal
directions of the Si plane. There is obvious anisotropy in the depth of
the amorphous atomic layer, the number and proportion of dislocation
nucleation, and the shear strain expansion. Although microscratch
experiments combined with the analysis of scratch variables and the
optical topography of scratches, it is concluded that the scratch
deformation damage towards the crystal orientation
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guidance for the ultra-precision machining of the anisotropy of 4H-SiC
crystal structure.
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