Investigation into Laser-Vibration-Assisted Cutting of Single-Crystal Silicon by Molecular Dynamics Simulation

JN Chu and YC Yang and YK Zang and JY Ke and ZY Wang and C Chen and JF He and AJ Xu and ZD She, MICROMACHINES, 16, 1411 (2025).

DOI: 10.3390/mi16121411

It is difficult to achieve ultra-precision machining (UPM) on semiconductor materials like single-crystal silicon because of their hardness and brittleness. To solve this issue, numerous field-assisted machining systems and their combinations have been suggested and developed. However, the difficulty in directly observing the physical variables limits our comprehension of the in-depth machining mechanisms of field-assisted machining. In this work, we investigated the machining mechanism of single-crystal silicon under the combination of laser heating and tool vibration using molecular dynamics (MD) simulations. The effect of tool vibration trajectory determined by different tool edge radii is discussed under the condition of raising temperature. The simulation results indicate that the surface morphology is closely related to vibration and heating parameters. Raising the cutting temperature causes a reversed relation between tool edge radius and surface roughness. While the subsurface damage and internal stress are also determined by the tool edge radius and cutting temperature. The findings in this simulation could help to improve the understanding of machining mechanics in multi-field-assisted machining.

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