MD Simulation and Experimental Study on the Cutting Mechanism of Laser- Assisted Cutting of SiCp/Al Composites

JQ Lin and HY Han and MM Lu and YS Du and C Zhang, JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE (2025).

DOI: 10.1007/s11665-025-12423-8

SiCp/Al composites are critical materials in aerospace optical applications. Nevertheless, the presence of SiC particles causes undesirable surface deformation and defects during the cutting process. Molecular dynamics simulation of conventional and laser assisted cutting of SiCp/Al were performed. The influences of laser power density, cutting depth, and cutting speed on tangential force, machined surface quality, workpiece material buildup, stress distribution, and dislocation were investigated. The results demonstrate that increasing laser power density leads to greater atomic stacking, which consequently enhances the thermal softening effect. The pulsed laser's energy dissipation process reduces undesirable thermal deformation, while its thermal effect mitigates deformation caused by particle extrusion and inhibits the formation of dislocations and slippage in the aluminum matrix. While the cutting depth rises, the surface roughness shows a gradual linear increase, and while the cutting depth coincides with the laser's heat-affected area, a flatter machined surface is derived. The results clarify the cutting mechanism in laser-assisted machining (LAM), highlighting its potential to improve both surface integrity and machining efficiency.

Return to Publications page