The relationship between deformation mechanisms and mechanical properties in nanocrystalline Cu/Ag-bilayer alloy

PT Li and CX Zhao and YH Jiang and F Cao and P Xiao and YT Song and ZY Hong and SW Gou and SH Liang, JOURNAL OF ALLOYS AND COMPOUNDS, 986, 174091 (2024).

DOI: 10.1016/j.jallcom.2024.174091

The nanocrystalline metallic bilayer structure can effectively enhance the strength of Cu alloy while maintaining excellent electrical conductivity. Based on the microstructure evolution of Cu/Ag alloy observed by transmission electron microscope (TEM), molecular dynamics (MD) simulations of Cu/Ag alloy with nanocrystalline metallic bilayer structure were established. The mechanical properties and deformation mechanisms of nanocrystalline Cu/Ag-bilayer alloys were investigated at different temperatures. A mixed Hall-Petch (H-P) relationship was observed between the ultimate stress and the increased layer thickness. In this paper, the deformation mechanism changes from dislocation accumulation at the Cu-Ag interface to dislocation through the Cu-Ag interface. In addition, the data analysis results of elastic modulus showed an approximately linear decrease trend with increasing temperature, and the deformation mechanism shifted from dislocation motion to a combination of dislocation motion and grain boundaries (GBs) diffusion. These findings provide guidance for the design of high magnetic field facility (HMFF) water-cooled magnets and very large-scale integration (VLSI) lead frames.

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