Research on SiC/Al laser-assisted nano-cutting based on molecular dynamics simulation

XF Wu and CT Su and DH Sun, MATERIALS TODAY COMMUNICATIONS, 41, 110525 (2024).

DOI: 10.1016/j.mtcomm.2024.110525

The laser-assisted nano-cutting process of SiC/Al was investigated using molecular dynamics simulation. The study focused on the effects of temperature, cutting depth, cutting speed, tool rake angle, and particle size on cutting force, workpiece materials pile-up, von Mises stress, and dislocation. The dislocation strengthening was found during SiC/Al laser-assisted nano cutting. Additionally, the results indicated that the thermal softening effect is more evident with the increase in temperature, resulting in smaller tangential force and normal force but with a consequent increase in the coefficient of friction and the number of stacked atoms. The study also explored the influence of cutting force and cutting temperature by the process parameters and investigated the role of strain rate and hardening effect in the cutting process. These results enhance the understanding of material removal and damage mechanisms during laser-assisted cutting and demonstrate that lasers can provide a potential technology to improve surface integrity and processing efficiency.

Return to Publications page