Boosting phonon transport across AlN/SiC interface by fast annealing amorphous layers

S Tian and TH Wu and SQ Hu and DK Ma and LF Zhang, APPLIED PHYSICS LETTERS, 124, 042202 (2024).

DOI: 10.1063/5.0187793

The high increase in interface density has become the main bottleneck for heat dissipation in gallium nitride/aluminum nitride (AlN)/silicon carbide (SiC) based nanodevices. In this paper, the interfacial thermal conductance (ITC) of AlN/SiC interface is investigated by non- equilibrium molecular dynamics simulation. It is found that introducing amorphous layers at AlN/SiC interface will result in an enhancement of its ITC by 2.32 times. Three different amorphous layers are investigated and can be achieved by fast thermal annealing. Among them, the amorphous SiC layers work best, and the amorphous AlN layers work worst. Further spectral analysis reveals that the enhancement of ITC comes from the strengthening of interfacial inelastic phonon processes, which boosts the transport of modes at a wide frequency range. What is more, as the thickness of amorphous layers increases, the enhancement of ITC weakens. This research provides a highly operational strategy to enhance ITC and enriches our understanding of inelastic phonon process at interface.

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