Prediction of crack initiation in single-crystal sapphire during ultra- precision machining using MD simulation-based slip/fracture activation model

SB Kwon and A Nagaraj and DN Kim and DL Xi and YY Du and WK Kim and SK Min, PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 86, 265-275 (2024).

DOI: 10.1016/j.precisioneng.2023.12.007

In this paper, material deformation during ultra-precision machining (UPM) on the C-, R-, and A-planes of sapphire was investigated using the slip/fracture activation model where the likelihood of activation of individual plastic deformation and fracture systems on different crystallographic planes was calculated. The stress data obtained from molecular dynamics (MD) simulations were utilized, and the slip/fracture activation model was developed by incorporating the principal stresses in calculating the plastic deformation and fracture cleavage parameters. The analysis methodology was applied to study material deformation along various cutting orientations in sapphire. The stress field at crack initiation during UPM on C-, R-, and A-planes of sapphire was calculated using molecular dynamics (MD) simulations. An equation describing the relationship between crack initiation and its triggering parameters was formulated considering the systems' plastic deformation and cleavage fractures. The model can qualitatively predict the crack initiations for various cutting orientations. The proposed model was verified through ultra-precision orthogonal plunge cut experiments along the same cutting orientations as in the MD simulations.

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