MD Simulation of Diffusion Behaviors in Collision Welding Processes of Al-Cu, Al-Al, Cu-Cu

DY Jin and G Wei, CMC-COMPUTERS MATERIALS & CONTINUA, 79, 3455-3468 (2024).

DOI: 10.32604/cmc.2024.048644

To investigate the effects of material combinations and velocity conditions on atomic diffusion behavior near collision interfaces, this study simulates the atomic diffusion behavior near collision interfaces in Cu-Al, Al-Al and Cu-Cu combinations fabricated through collision welding using molecular dynamic (MD) simulation. The atomic diffusion behaviors are compared between similar metal combinations (Al-Al, Cu-Cu) and dissimilar metal combinations (Al-Cu). By combining the simulation results and classical diffusion theory, the diffusion coefficients for similar and dissimilar metal material combinations under different velocity conditions are obtained. The effects of material combinations and collision velocity on diffusion behaviors are also discussed. The diffusion behaviors of dissimilar material combinations strongly depend on the transverse velocity, whereas those of the similar material combinations are more dependent on the longitudinal velocity. These findings can provide guidance for optimizing welding parameters.

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