The tensile and compressive deformation mechanisms of the Cu/Al2Cu/Al-layered composites via molecular dynamics simulation

XQ Bian and AQ Wang and JP Xie and P Liu and ZP Mao and ZW Liu, APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 129, 719 (2023).

DOI: 10.1007/s00339-023-07002-4

To investigate the compression and deformation behavior of nano- polycrystalline Cu/Al2Cu/Al-layered composites, it was constructed and analyzed using molecular dynamics simulation (MD). The findings indicate that The Cu/Al2Cu/Al materials exhibit sensitivity to changes in the interfacial layer d due to the asymmetry between tensile and compressive deformations. The compressive strain strengthening of the nano- polycrystalline Cu/Al2Cu/Al-layered composites increases as the interfacial layer d increases. During the tensile process, an increase in interfacial layer d leads to an increase in Young's modulus, while the fracture strength and fracture strain first increase and then decrease. The interfacial layer with a value of d = 4.88 nm promotes the delocalization of strain during the tensile and compressive deformation of nano-polycrystalline Cu/Al2Cu/Al materials. It facilitates cooperative deformation behavior between components, leading to improved toughness and strength of the materials.

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