**Diffusion and incidence of helium on tungsten surface**

JL Wang and JM Guo and BL He and DP Liu and XD Pan and XC Li and GN Luo, JOURNAL OF NUCLEAR MATERIALS, 586, 154689 (2023).

DOI: 10.1016/j.jnucmat.2023.154689

In this study, we investigated the diffusion and incidence of helium on tungsten surfaces using first principles and molecular dynamics methods. For three common tungsten surfaces (100, 111, 110), we found that the diffusion barrier of helium is positively/negatively correlated with the interatomic spacing/surface atomic density. The diffusion barriers of helium are relatively similar on the three surfaces, ranging from 5.82 to 6.50 eV. The diffusion barrier of helium on the tungsten surface represents the lower limit of the incidence barrier for helium implantation into tungsten. In our simulation, only helium with an incidence energy greater than 7 eV has the potential to be implanted into tungsten. Generally speaking, the implantation ratio of helium increases with increasing incidence energy and decreases with increasing substrate temperature (although the effect is minor). At a constant temperature, the implantation ratio of helium exhibits an exponential relationship with the incidence energy. The depth distribution of helium can be well described by Gamma distribution function, and the shape and scale parameters of the gamma distribution function can be determined based on the mean and variance of the helium depth distribution. The proposed fitting function allows for the quantitative description of the mean and variance of the helium depth distribution based on the incidence conditions (incident energy E and substrate temperature T), thereby determining the helium depth distribution. This has important implications for the in-depth study of helium-induced tungsten surface fuzz formation.

Return to Publications page