Understanding the role of surface mechanical properties in SiC surface machining

YH Huang and YQ Zhou and JM Li and FL Zhu, MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 163, 107594 (2023).

DOI: 10.1016/j.mssp.2023.107594

Surface modification layers play a crucial role in enhancing machinability during reaction-assisted machining due to the interrelated behavior of the surface and interface resulting from their structure- properties relationship. However, determining the impact of surface mechanical properties on a coherent interface through experiments is challenging. To overcome this limitation, atomistic simulations were performed, which involved constructing coherent interfaces with varying mechanical properties by adjusting the Tersoff-style potential function. The 4H-SiC machining example involved introducing soft, pristine, and modification layers. The findings indicated that the soft layer acted as a buffer, reducing substrate stress, while the modification layer enhanced efficiency at greater penetration depths, and near-interface dynamic behaviors were altered. Additionally, it was indirectly suggested that the effect of a harder modification layer on the interface may be more significant than the difference in mechanical properties between the modification layer and substrate.

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