Understanding the plasticity contributions during laser-shock loading and spall failure of Cu microstructures at the atomic scales

MJ Echeverria and S Galitskiy and A Mishra and R Dingreville and AM Dongare, COMPUTATIONAL MATERIALS SCIENCE, 198, 110668 (2021).

DOI: 10.1016/j.commatsci.2021.110668

A hybrid atomic-scale and continuum-modeling framework is used to study the microstructural evolution during the laser-induced shock deformation and failure (spallation) of copper microstructures. A continuum twotemperature model (TTM) is used to account for the interaction of Cu atoms with a laser in molecular dynamics (MD) simulations. The MD-TTM simulations study the effect of laser-loading conditions (laser fluence) on the microstructure (defects) evolution during various stages of shock wave propagation, reflection, and interaction in single-crystal (sc) Cu systems. In addition, the role of the microstructure is investigated by comparing the defect evolution and spall response of sc-Cu and nanocrystalline Cu systems. The defect (stacking faults and twin faults) evolution behavior in the metal at various times is further characterized using virtual in situ selected area electron diffraction and x-ray diffraction during various stages of evolution of microstructure. The simulations elucidate the uncertain relation between spall strength and strain-rate and the much stronger relation between the spall strength and the temperatures generated due to laser shock loading for the small Cu sample dimensions considered here.

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