Inverse Hall-Petch relationship of high-entropy alloy by atomistic simulation
L Zhang and Y Shibuta, MATERIALS LETTERS, 274, 128024 (2020).
Molecular dynamics simulations were carried out to investigate the
mechanical properties and the Hall-Petch effect of high-entropy alloy
using the interatomic potential for the multi-element FeNiCrCoCu. The
transition from mechanical strengthening to softening was observed for
the simulated samples with the mean grain size ranging from 28.44 to
5.33 nm. The critical grain size of the inverse Hall-Petch relationship
increases with the increase of temperature from 10 K to 600 K.
Deformation mechanisms caused by grain boundaries and the dislocation
activities are involved in accommodating the system stress in the small
grain samples during plastic deformation.
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