Control of nanoscale material removal in diamond polishing by using iron at low temperature

N Yang and W Huang and DJ Lei, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 278, 116521 (2020).

DOI: 10.1016/j.jmatprotec.2019.116521

Diamond is the most promising material for future applications in the fields of semiconductors and optics due to its extraordinary physical properties. The development of diamond processing technology, especially polishing, is of great importance for diamond applications. Diamond friction during polishing usually occurs at room temperature. In this paper, the material removal rate at low temperature (about the temperature of liquid nitrogen) is studied by using molecular dynamics (MD) simulation and designed experiments. This study reveals that the inhibitory effect of low temperature on diamond removal is an efficient way to control the diamond material removal rate in the nanoscale range and enables the control of material removal on an atomic scale in diamond polishing.

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